From November 23 to 25, the China Packaging Federation celebrated its 45th anniversary with the Packaging Industry High-Quality Development Conference and the second session of its 10th Council in Jiangyin. During the event, the results of the 2025 Packaging Industry Science and Technology Awards were announced. Techsun’s project, Key Technology Research and Industrial Application of the “3+1 Prevention” Packaging Box and RFID Smart Cap, earned the Third Prize in recognition of its outstanding technological innovation and significant industrial benefits.

As a national-level specialized and sophisticated “Little Giant” enterprise and a National Intellectual Property Advantage Enterprise, Shanghai Techsun has consistently driven packaging industry upgrades through technological innovation. Moving forward, Techsun will continue to deepen its focus on the integration of anti-counterfeiting traceability and smart packaging. Leveraging self-developed chips, new materials, and digital platforms, the company is committed to safeguarding consumer goods safety and brand value, and to helping China’s packaging industry advance into a new era of high-quality, digital, and intelligent development.